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Room-Temperature and Compressive Force-Free Metal-Metal Direct Bonding for Heterogeneous Integration of Micro-LED Array on 3D-IC

Jiayi Shen, Chang Liu, Tetsu Tanaka, Takafumi Fukushima. Room-Temperature and Compressive Force-Free Metal-Metal Direct Bonding for Heterogeneous Integration of Micro-LED Array on 3D-IC. In International 3D Systems Integration Conference, 3DIC 2024, Sendai, Japan, September 25-27, 2024. pages 1-3, IEEE, 2024. [doi]

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