Resistive analysis of mixed carbon nanotube bundle interconnect and its comparison with copper interconnect - researchr publication authors

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T. Alam, Rohit Dhiman, Rajeevan Chandel. Resistive analysis of mixed carbon nanotube bundle interconnect and its comparison with copper interconnect. In B. K. Mishra, editor, Proceedings of the ICWET 11 International Conference & Workshop on Emerging Trends in Technology, Mumbai, Maharashtra, India, February 25 - 26, 2011. pages 1157-1160, ACM, 2011. [doi]

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