Resistive analysis of mixed carbon nanotube bundle interconnect and its comparison with copper interconnect

T. Alam, Rohit Dhiman, Rajeevan Chandel. Resistive analysis of mixed carbon nanotube bundle interconnect and its comparison with copper interconnect. In B. K. Mishra, editor, Proceedings of the ICWET 11 International Conference & Workshop on Emerging Trends in Technology, Mumbai, Maharashtra, India, February 25 - 26, 2011. pages 1157-1160, ACM, 2011. [doi]

Abstract

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