Syed M. Alam, Chee Lip Gan, Carl V. Thompson, Donald E. Troxel. Circuit Level Reliability Analysis of Cu Interconnects. In 5th International Symposium on Quality of Electronic Design (ISQED 2004), 22-24 March 2004, San Jose, CA, USA. pages 238-243, IEEE Computer Society, 2004. [doi]
Abstract is missing.