Thermal issues in test: An overview of the significant aspects and industrial practice

J. Alt, Paolo Bernardi, Alberto Bosio, Riccardo Cantoro, Hans G. Kerkhoff, Andreas Leininger, Wolfgang Molzer, A. Motta, Christian Pacha, A. Pagani, Alireza Rohani, R. Strasser. Thermal issues in test: An overview of the significant aspects and industrial practice. In 34th IEEE VLSI Test Symposium, VTS 2016, Las Vegas, NV, USA, April 25-27, 2016. pages 1-4, IEEE Computer Society, 2016. [doi]

Abstract

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