Hideharu Amano, Tadahiro Kuroda, Hiroshi Nakamura, Kimiyoshi Usami, Masaaki Kondo, Hiroki Matsutani, Mitaro Namiki. Building block multi-chip systems using inductive coupling through chip interface. In International SoC Design Conference, ISOCC 2017, Seoul, Korea (South), November 5-8, 2017. pages 152-154, IEEE, 2017. [doi]
Abstract is missing.