Yuuki Araga, Kikuchi Katsuya, Masahiro Aoyagi. Substrate monitoring system for inspecting defects in TSV-based data buses. In 2014 International 3D Systems Integration Conference, 3DIC 2014, Kinsdale, Ireland, December 1-3, 2014. pages 1-5, IEEE, 2014. [doi]
Abstract is missing.