A study on substrate noise coupling among TSVs in 3D chip stack

Yuuki Araga, Makoto Nagata, Joeri De Vos, Geert Van der Plas, Eric Beyne. A study on substrate noise coupling among TSVs in 3D chip stack. IEICE Electronic Express, 15(13):20180460, 2018. [doi]

Abstract

Abstract is missing.