Panel discussions: Toward wearable computing era, how COOL chip architecture and tools will evolve? - researchr publication

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Fumio Arakawa. Panel discussions: Toward wearable computing era, how COOL chip architecture and tools will evolve?. In 2014 IEEE Symposium on Low-Power and High-Speed Chips, COOL Chips XVII, Yokohama, Japan, April 14-16, 2014. pages 1-2, IEEE, 2014. [doi]

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