Amirali Shayan Arani, Xiang Hu, He Peng, Chung-Kuan Cheng, Wenjian Yu, Mikhail Popovich, Thomas Toms, Xiaoming Chen. Reliability aware through silicon via planning for 3D stacked ICs. In Design, Automation and Test in Europe, DATE 2009, Nice, France, April 20-24, 2009. pages 288-291, IEEE, 2009. [doi]
Abstract is missing.