E. Armagan, A. Saha, K. C. Liu, B. Gebrehiwot, M. Cartas, A. Das, T. Rawlings, P. Raghavan. Knowledge Based Qualification for Thermal Interface Material Reliability. In IEEE International Reliability Physics Symposium, IRPS 2023, Monterey, CA, USA, March 26-30, 2023. pages 1-7, IEEE, 2023. [doi]
@inproceedings{ArmaganSLGCDRR23,
title = {Knowledge Based Qualification for Thermal Interface Material Reliability},
author = {E. Armagan and A. Saha and K. C. Liu and B. Gebrehiwot and M. Cartas and A. Das and T. Rawlings and P. Raghavan},
year = {2023},
doi = {10.1109/IRPS48203.2023.10117756},
url = {https://doi.org/10.1109/IRPS48203.2023.10117756},
researchr = {https://researchr.org/publication/ArmaganSLGCDRR23},
cites = {0},
citedby = {0},
pages = {1-7},
booktitle = {IEEE International Reliability Physics Symposium, IRPS 2023, Monterey, CA, USA, March 26-30, 2023},
publisher = {IEEE},
isbn = {978-1-6654-5672-2},
}