Krit Athikulwongse, Mohit Pathak, Sung Kyu Lim. Exploiting die-to-die thermal coupling in 3D IC placement. In Patrick Groeneveld, Donatella Sciuto, Soha Hassoun, editors, The 49th Annual Design Automation Conference 2012, DAC '12, San Francisco, CA, USA, June 3-7, 2012. pages 741-746, ACM, 2012. [doi]
Abstract is missing.