B. Ayoub, Stéphane Moreau, S. Lhostis, P. Lamontagne, H. Combeau, J. G. Mattei, H. Frémont. New Method to Perform TDDB Tests for Hybrid Bonding Interconnects. In IEEE International Reliability Physics Symposium, IRPS 2022, Dallas, TX, USA, March 27-31, 2022. pages 4, IEEE, 2022. [doi]
Abstract is missing.