AWafer-Level Defect Screening Technique to Reduce Test and Packaging Costs for Big-D/Small-A Mixed-Signal SoCs - researchr publication authors

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Sudarshan Bahukudumbi, Sule Ozev, Krishnendu Chakrabarty, Vikram Iyengar. AWafer-Level Defect Screening Technique to Reduce Test and Packaging Costs for Big-D/Small-A Mixed-Signal SoCs. In Proceedings of the 12th Conference on Asia South Pacific Design Automation, ASP-DAC 2007, Yokohama, Japan, January 23-26, 2007. pages 823-828, IEEE, 2007. [doi]

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