AWafer-Level Defect Screening Technique to Reduce Test and Packaging Costs for Big-D/Small-A Mixed-Signal SoCs

Sudarshan Bahukudumbi, Sule Ozev, Krishnendu Chakrabarty, Vikram Iyengar. AWafer-Level Defect Screening Technique to Reduce Test and Packaging Costs for Big-D/Small-A Mixed-Signal SoCs. In Proceedings of the 12th Conference on Asia South Pacific Design Automation, ASP-DAC 2007, Yokohama, Japan, January 23-26, 2007. pages 823-828, IEEE, 2007. [doi]

@inproceedings{BahukudumbiOCI07,
  title = {AWafer-Level Defect Screening Technique to Reduce Test and Packaging Costs for  Big-D/Small-A  Mixed-Signal SoCs},
  author = {Sudarshan Bahukudumbi and Sule Ozev and Krishnendu Chakrabarty and Vikram Iyengar},
  year = {2007},
  doi = {10.1109/ASPDAC.2007.358091},
  url = {http://doi.ieeecomputersociety.org/10.1109/ASPDAC.2007.358091},
  tags = {testing},
  researchr = {https://researchr.org/publication/BahukudumbiOCI07},
  cites = {0},
  citedby = {0},
  pages = {823-828},
  booktitle = {Proceedings of the 12th Conference on Asia South Pacific Design Automation, ASP-DAC 2007, Yokohama, Japan, January 23-26, 2007},
  publisher = {IEEE},
}