Wafer-level package interconnect options

J. Balachandran, Steven Brebels, G. Carchon, M. Kuijk, Walter De Raedt, Bart Nauwelaers, Eric Beyne. Wafer-level package interconnect options. IEEE Trans. VLSI Syst., 14(6):654-659, 2006. [doi]

Abstract

Abstract is missing.