3-D stacked die: now or future?

Samta Bansal, Juan C. Rey, Andrew Yang, Myung-Soo Jang, L. C. Lu, Philippe Magarshack, Pol Marchal, Riko Radojcic. 3-D stacked die: now or future?. In Sachin S. Sapatnekar, editor, Proceedings of the 47th Design Automation Conference, DAC 2010, Anaheim, California, USA, July 13-18, 2010. pages 298-299, ACM, 2010. [doi]

Abstract

Abstract is missing.