Cemal Basaran, Juan Gomez, Minghui Lin, Shidong Li. Damage mechanics modeling of concurrent thermal and vibration loading on electronics packaging. In Gabriel Andrés Wainer, editor, Proceedings of the 2007 Summer Computer Simulation Conference, SCSC 2007, San Diego, California, USA, July 16-19, 2007. pages 269-275, Simulation Councils, Inc., 2007. [doi]
Abstract is missing.