Computational simulation of electromigration induced damage in copper interconnects - researchr publication authors

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Cemal Basaran, Minghui Lin, Shidong Li. Computational simulation of electromigration induced damage in copper interconnects. In Gabriel Andrés Wainer, editor, Proceedings of the 2007 Summer Computer Simulation Conference, SCSC 2007, San Diego, California, USA, July 16-19, 2007. pages 261-268, Simulation Councils, Inc., 2007. [doi]

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