Cemal Basaran, Minghui Lin, Shidong Li. Computational simulation of electromigration induced damage in copper interconnects. In Gabriel Andrés Wainer, editor, Proceedings of the 2007 Summer Computer Simulation Conference, SCSC 2007, San Diego, California, USA, July 16-19, 2007. pages 261-268, Simulation Councils, Inc., 2007. [doi]
@inproceedings{BasaranLL07,
title = {Computational simulation of electromigration induced damage in copper interconnects},
author = {Cemal Basaran and Minghui Lin and Shidong Li},
year = {2007},
doi = {10.1145/1357910.1357953},
url = {http://doi.acm.org/10.1145/1357910.1357953},
researchr = {https://researchr.org/publication/BasaranLL07},
cites = {0},
citedby = {0},
pages = {261-268},
booktitle = {Proceedings of the 2007 Summer Computer Simulation Conference, SCSC 2007, San Diego, California, USA, July 16-19, 2007},
editor = {Gabriel Andrés Wainer},
publisher = {Simulation Councils, Inc.},
isbn = {1-56555-316-0},
}