Design and analysis of jitter-aware low-power and high-speed TSV link for 3D ICs

Giulia Beanato, Kiarash Gharibdoust, Alessandro Cevrero, Giovanni De Micheli, Yusuf Leblebici. Design and analysis of jitter-aware low-power and high-speed TSV link for 3D ICs. Microelectronics Journal, 48:50-59, 2016. [doi]

Abstract

Abstract is missing.