Kerry Bernstein, Paul Andry, Jerome Cann, Philip G. Emma, David Greenberg, Wilfried Haensch, Mike Ignatowski, Steve Koester, John Magerlein, Ruchir Puri, Albert M. Young. Interconnects in the Third Dimension: Design Challenges for 3D ICs. In Proceedings of the 44th Design Automation Conference, DAC 2007, San Diego, CA, USA, June 4-8, 2007. pages 562-567, IEEE, 2007. [doi]
Abstract is missing.