Multi-Chiplet Heterogeneous Integration Packaging for Semiconductor System Scaling - researchr publication authors

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Surya Bhattacharya, Vempati Srinivasa Rao. Multi-Chiplet Heterogeneous Integration Packaging for Semiconductor System Scaling. In 2023 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits), Kyoto, Japan, June 11-16, 2023. pages 1-4, IEEE, 2023. [doi]

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