Surya Bhattacharya, Vempati Srinivasa Rao. Multi-Chiplet Heterogeneous Integration Packaging for Semiconductor System Scaling. In 2023 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits), Kyoto, Japan, June 11-16, 2023. pages 1-4, IEEE, 2023. [doi]
@inproceedings{BhattacharyaR23,
title = {Multi-Chiplet Heterogeneous Integration Packaging for Semiconductor System Scaling},
author = {Surya Bhattacharya and Vempati Srinivasa Rao},
year = {2023},
doi = {10.23919/VLSITechnologyandCir57934.2023.10185396},
url = {https://doi.org/10.23919/VLSITechnologyandCir57934.2023.10185396},
researchr = {https://researchr.org/publication/BhattacharyaR23},
cites = {0},
citedby = {0},
pages = {1-4},
booktitle = {2023 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits), Kyoto, Japan, June 11-16, 2023},
publisher = {IEEE},
isbn = {978-4-86348-806-9},
}