Die Stacking (3D) Microarchitecture - researchr publication authors

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Bryan Black, Murali Annavaram, Ned Brekelbaum, John DeVale, Lei Jiang, Gabriel H. Loh, Don McCaule, Pat Morrow, Donald W. Nelson, Daniel Pantuso, Paul Reed, Jeff Rupley, Sadasivan Shankar, John Paul Shen, Clair Webb. Die Stacking (3D) Microarchitecture. In 39th Annual IEEE/ACM International Symposium on Microarchitecture (MICRO-39 2006), 9-13 December 2006, Orlando, Florida, USA. pages 469-479, IEEE Computer Society, 2006. [doi]

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