Bryan Black, Murali Annavaram, Ned Brekelbaum, John DeVale, Lei Jiang, Gabriel H. Loh, Don McCaule, Pat Morrow, Donald W. Nelson, Daniel Pantuso, Paul Reed, Jeff Rupley, Sadasivan Shankar, John Paul Shen, Clair Webb. Die Stacking (3D) Microarchitecture. In 39th Annual IEEE/ACM International Symposium on Microarchitecture (MICRO-39 2006), 9-13 December 2006, Orlando, Florida, USA. pages 469-479, IEEE Computer Society, 2006. [doi]
@inproceedings{BlackABDJLMMNPRRSSW06,
title = {Die Stacking (3D) Microarchitecture},
author = {Bryan Black and Murali Annavaram and Ned Brekelbaum and John DeVale and Lei Jiang and Gabriel H. Loh and Don McCaule and Pat Morrow and Donald W. Nelson and Daniel Pantuso and Paul Reed and Jeff Rupley and Sadasivan Shankar and John Paul Shen and Clair Webb},
year = {2006},
doi = {10.1109/MICRO.2006.18},
url = {http://doi.ieeecomputersociety.org/10.1109/MICRO.2006.18},
researchr = {https://researchr.org/publication/BlackABDJLMMNPRRSSW06},
cites = {0},
citedby = {0},
pages = {469-479},
booktitle = {39th Annual IEEE/ACM International Symposium on Microarchitecture (MICRO-39 2006), 9-13 December 2006, Orlando, Florida, USA},
publisher = {IEEE Computer Society},
}