Wolf-Ekkehard Blanz, Jorge L. C. Sanz, Eric B. Hinkle. Image analysis methods for solderball inspection in integrated circuit manufacturing. IEEE Transactions on Robotics, 4(2):129-139, 1988. [doi]
@article{BlanzSH88,
title = {Image analysis methods for solderball inspection in integrated circuit manufacturing},
author = {Wolf-Ekkehard Blanz and Jorge L. C. Sanz and Eric B. Hinkle},
year = {1988},
doi = {10.1109/56.2076},
url = {http://dx.doi.org/10.1109/56.2076},
researchr = {https://researchr.org/publication/BlanzSH88},
cites = {0},
citedby = {0},
journal = {IEEE Transactions on Robotics},
volume = {4},
number = {2},
pages = {129-139},
}