Fabian Boeser, Benjamin G. Lang, Thomas Stieglitz, Dennis T. T. Plachta. Epoxy casting used as nonhermetic encapsulation technique for implantable electronic devices. In 38th Annual International Conference of the IEEE Engineering in Medicine and Biology Society, EMBC 2016, Orlando, FL, USA, August 16-20, 2016. pages 1938-1941, IEEE, 2016. [doi]
Abstract is missing.