Compact interconnect approach for networks of neural cliques using 3D technology

Bartosz Boguslawski, Hossam Sarhan, Frédéric Heitzmann, Fabrice Seguin, Sebastien Thuries, Olivier Billoint, Fabien Clermidy. Compact interconnect approach for networks of neural cliques using 3D technology. In 2015 IFIP/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2015, Daejeon, South Korea, October 5-7, 2015. pages 116-121, IEEE, 2015. [doi]

Abstract

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