Descriptive Language For 3D IC Die-to-Die Interconnect Repair For IEEE P3405 Standard - researchr publication

researchr

You are not signed in
Sign in
Sign up

Ashish Reddy Bommana, Anshuman Chandra, Moiz Khan. Descriptive Language For 3D IC Die-to-Die Interconnect Repair For IEEE P3405 Standard. In IEEE International Test Conference in Asia, ITC-Asia 2025, Tokyo, Japan, December 16-19, 2025. pages 1-6, IEEE, 2025. [doi]

Abstract is missing.

runs on WebDSL