Bobby Bose, Ishan G. Thakkar. Characterization and Mitigation of Electromigration Effects in TSV-Based Power Delivery Network Enabled 3D-Stacked DRAMs. In Yiran Chen, Victor V. Zhirnov, Avesta Sasan, Ioannis Savidis, editors, GLSVLSI '21: Great Lakes Symposium on VLSI 2021, Virtual Event, USA, June 22-25, 2021. pages 101-107, ACM, 2021. [doi]
@inproceedings{BoseT21,
title = {Characterization and Mitigation of Electromigration Effects in TSV-Based Power Delivery Network Enabled 3D-Stacked DRAMs},
author = {Bobby Bose and Ishan G. Thakkar},
year = {2021},
doi = {10.1145/3453688.3461503},
url = {https://doi.org/10.1145/3453688.3461503},
researchr = {https://researchr.org/publication/BoseT21},
cites = {0},
citedby = {0},
pages = {101-107},
booktitle = {GLSVLSI '21: Great Lakes Symposium on VLSI 2021, Virtual Event, USA, June 22-25, 2021},
editor = {Yiran Chen and Victor V. Zhirnov and Avesta Sasan and Ioannis Savidis},
publisher = {ACM},
isbn = {978-1-4503-8393-6},
}