Bobby Bose, Ishan G. Thakkar. Characterization and Mitigation of Electromigration Effects in TSV-Based Power Delivery Network Enabled 3D-Stacked DRAMs. In Yiran Chen, Victor V. Zhirnov, Avesta Sasan, Ioannis Savidis, editors, GLSVLSI '21: Great Lakes Symposium on VLSI 2021, Virtual Event, USA, June 22-25, 2021. pages 101-107, ACM, 2021. [doi]
Abstract is missing.