A Circuit Packaging Model for High-Speed Computer Technology

Fred K. Buelow, Frank B. Hartman, E. Leon Willette, John J. Zasio. A Circuit Packaging Model for High-Speed Computer Technology. IBM Journal of Research and Development, 7(3):182-189, 1963. [doi]

Authors

Fred K. Buelow

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Frank B. Hartman

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E. Leon Willette

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John J. Zasio

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