Fred K. Buelow, Frank B. Hartman, E. Leon Willette, John J. Zasio. A Circuit Packaging Model for High-Speed Computer Technology. IBM Journal of Research and Development, 7(3):182-189, 1963. [doi]
@article{BuelowHWZ63,
title = {A Circuit Packaging Model for High-Speed Computer Technology},
author = {Fred K. Buelow and Frank B. Hartman and E. Leon Willette and John J. Zasio},
year = {1963},
doi = {10.1147/rd.73.0182},
url = {http://dx.doi.org/10.1147/rd.73.0182},
researchr = {https://researchr.org/publication/BuelowHWZ63},
cites = {0},
citedby = {0},
journal = {IBM Journal of Research and Development},
volume = {7},
number = {3},
pages = {182-189},
}