Tapeout class: Taking students from schematic to silicon in one semester

David C. Burnett, Brian Kilberg, Rachel Zoll, Osama Khan, Kristofer S. J. Pister. Tapeout class: Taking students from schematic to silicon in one semester. In IEEE International Symposium on Circuits and Systems, ISCAS 2018, 27-30 May 2018, Florence, Italy. pages 1-5, IEEE, 2018. [doi]

@inproceedings{BurnettKZKP18,
  title = {Tapeout class: Taking students from schematic to silicon in one semester},
  author = {David C. Burnett and Brian Kilberg and Rachel Zoll and Osama Khan and Kristofer S. J. Pister},
  year = {2018},
  doi = {10.1109/ISCAS.2018.8351506},
  url = {https://doi.org/10.1109/ISCAS.2018.8351506},
  researchr = {https://researchr.org/publication/BurnettKZKP18},
  cites = {0},
  citedby = {0},
  pages = {1-5},
  booktitle = {IEEE International Symposium on Circuits and Systems, ISCAS 2018, 27-30 May 2018, Florence, Italy},
  publisher = {IEEE},
  isbn = {978-1-5386-4881-0},
}