Mitigating Partitioning, Routing, and Yield Concerns in 3D ICs by Multiplexing TSVs - researchr publication authors

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Michael Buttrick, Sandip Kundu. Mitigating Partitioning, Routing, and Yield Concerns in 3D ICs by Multiplexing TSVs. In IEEE Computer Society Annual Symposium on VLSI, ISVLSI 2011, 4-6 July 2011, Chennai, India. pages 194-199, IEEE Computer Society, 2011. [doi]

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