Michael Buttrick, Sandip Kundu. Mitigating Partitioning, Routing, and Yield Concerns in 3D ICs by Multiplexing TSVs. In IEEE Computer Society Annual Symposium on VLSI, ISVLSI 2011, 4-6 July 2011, Chennai, India. pages 194-199, IEEE Computer Society, 2011. [doi]
@inproceedings{ButtrickK11, title = {Mitigating Partitioning, Routing, and Yield Concerns in 3D ICs by Multiplexing TSVs}, author = {Michael Buttrick and Sandip Kundu}, year = {2011}, doi = {10.1109/ISVLSI.2011.27}, url = {http://dx.doi.org/10.1109/ISVLSI.2011.27}, tags = {routing, partitioning}, researchr = {https://researchr.org/publication/ButtrickK11}, cites = {0}, citedby = {0}, pages = {194-199}, booktitle = {IEEE Computer Society Annual Symposium on VLSI, ISVLSI 2011, 4-6 July 2011, Chennai, India}, publisher = {IEEE Computer Society}, }