Bertrand Cabon, T. V. Dinh, J. Chilo. Superconductive interconnections in multi-chip modules. In Kakayuki Yanagawa, Peter A. Ivey, editors, VLSI 93, Proceedings of the IFIP TC10/WG 10.5 International Conference on Very Large Scale Integration, Grenoble, France, 7-10 September, 1993. Volume A-42 of IFIP Transactions, pages 291-298, North-Holland, 1993.
@inproceedings{CabonDC93,
title = {Superconductive interconnections in multi-chip modules},
author = {Bertrand Cabon and T. V. Dinh and J. Chilo},
year = {1993},
researchr = {https://researchr.org/publication/CabonDC93},
cites = {0},
citedby = {0},
pages = {291-298},
booktitle = {VLSI 93, Proceedings of the IFIP TC10/WG 10.5 International Conference on Very Large Scale Integration, Grenoble, France, 7-10 September, 1993},
editor = {Kakayuki Yanagawa and Peter A. Ivey},
volume = {A-42},
series = {IFIP Transactions},
publisher = {North-Holland},
isbn = {0-444-89911-1},
}