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Superconductive interconnections in multi-chip modules

Bertrand Cabon, T. V. Dinh, J. Chilo. Superconductive interconnections in multi-chip modules. In Kakayuki Yanagawa, Peter A. Ivey, editors, VLSI 93, Proceedings of the IFIP TC10/WG 10.5 International Conference on Very Large Scale Integration, Grenoble, France, 7-10 September, 1993. Volume A-42 of IFIP Transactions, pages 291-298, North-Holland, 1993.

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