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A novel soldering method to evaluate PCB pad cratering for pin-pull testing

M. Cai, D. J. Xie, W. B. Chen, B. Y. Wu, D. G. Yang, G. Q. Zhang. A novel soldering method to evaluate PCB pad cratering for pin-pull testing. Microelectronics Reliability, 53(9-11):1568-1574, 2013. [doi]

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M. Cai

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D. J. Xie

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W. B. Chen

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B. Y. Wu

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D. G. Yang

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G. Q. Zhang

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