A novel soldering method to evaluate PCB pad cratering for pin-pull testing

M. Cai, D. J. Xie, W. B. Chen, B. Y. Wu, D. G. Yang, G. Q. Zhang. A novel soldering method to evaluate PCB pad cratering for pin-pull testing. Microelectronics Reliability, 53(9-11):1568-1574, 2013. [doi]

Abstract

Abstract is missing.