M. Cai, D. J. Xie, W. B. Chen, B. Y. Wu, D. G. Yang, G. Q. Zhang. A novel soldering method to evaluate PCB pad cratering for pin-pull testing. Microelectronics Reliability, 53(9-11):1568-1574, 2013. [doi]
@article{CaiXCWYZ13,
title = {A novel soldering method to evaluate PCB pad cratering for pin-pull testing},
author = {M. Cai and D. J. Xie and W. B. Chen and B. Y. Wu and D. G. Yang and G. Q. Zhang},
year = {2013},
doi = {10.1016/j.microrel.2013.07.025},
url = {http://dx.doi.org/10.1016/j.microrel.2013.07.025},
researchr = {https://researchr.org/publication/CaiXCWYZ13},
cites = {0},
citedby = {0},
journal = {Microelectronics Reliability},
volume = {53},
number = {9-11},
pages = {1568-1574},
}