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Advanced Thermal Modeling of IC - Package Interaction

Zhibo Cao, Matteo Stocchi, Matthias Wietstruck, Federico Garbuglia, Diego Pincini, Mehmet Kaynak. Advanced Thermal Modeling of IC - Package Interaction. In 2020 IEEE Radio and Wireless Symposium, RWS 2020, San Antonio, TX, USA, January 26-29, 2020. pages 326-329, IEEE, 2020. [doi]

Authors

Zhibo Cao

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Matteo Stocchi

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Matthias Wietstruck

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Federico Garbuglia

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Diego Pincini

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Mehmet Kaynak

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