Zhibo Cao, Matteo Stocchi, Matthias Wietstruck, Federico Garbuglia, Diego Pincini, Mehmet Kaynak. Advanced Thermal Modeling of IC - Package Interaction. In 2020 IEEE Radio and Wireless Symposium, RWS 2020, San Antonio, TX, USA, January 26-29, 2020. pages 326-329, IEEE, 2020. [doi]
@inproceedings{CaoSWGPK20,
title = {Advanced Thermal Modeling of IC - Package Interaction},
author = {Zhibo Cao and Matteo Stocchi and Matthias Wietstruck and Federico Garbuglia and Diego Pincini and Mehmet Kaynak},
year = {2020},
doi = {10.1109/RWS45077.2020.9050057},
url = {https://doi.org/10.1109/RWS45077.2020.9050057},
researchr = {https://researchr.org/publication/CaoSWGPK20},
cites = {0},
citedby = {0},
pages = {326-329},
booktitle = {2020 IEEE Radio and Wireless Symposium, RWS 2020, San Antonio, TX, USA, January 26-29, 2020},
publisher = {IEEE},
isbn = {978-1-7281-1120-9},
}