Víctor H. Champac, Freddy Forero, Michel Renovell, Leonardo Miceli. A New Defect Model due to a Dust Particle Affecting the Fingers of FinFET Logic Gates. In 24th IEEE Latin American Test Symposium, LATS 2023, Veracruz, Mexico, March 21-24, 2023. pages 1-6, IEEE, 2023. [doi]
Abstract is missing.