Reliability-constrained die stacking order in 3DICs under manufacturing variability - researchr publication authors

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Tuck Boon Chan, Andrew B. Kahng, Jiajia Li. Reliability-constrained die stacking order in 3DICs under manufacturing variability. In International Symposium on Quality Electronic Design, ISQED 2013, Santa Clara, CA, USA, March 4-6, 2013. pages 16-23, IEEE, 2013. [doi]

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