Tuck Boon Chan, Andrew B. Kahng, Jiajia Li. Reliability-constrained die stacking order in 3DICs under manufacturing variability. In International Symposium on Quality Electronic Design, ISQED 2013, Santa Clara, CA, USA, March 4-6, 2013. pages 16-23, IEEE, 2013. [doi]
@inproceedings{ChanKL13-0,
title = {Reliability-constrained die stacking order in 3DICs under manufacturing variability},
author = {Tuck Boon Chan and Andrew B. Kahng and Jiajia Li},
year = {2013},
doi = {10.1109/ISQED.2013.6523584},
url = {http://dx.doi.org/10.1109/ISQED.2013.6523584},
researchr = {https://researchr.org/publication/ChanKL13-0},
cites = {0},
citedby = {0},
pages = {16-23},
booktitle = {International Symposium on Quality Electronic Design, ISQED 2013, Santa Clara, CA, USA, March 4-6, 2013},
publisher = {IEEE},
isbn = {978-1-4673-4951-2},
}