Thermal Driven Test Access Routing in Hyper-interconnected Three-Dimensional System-on-Chip

Unni Chandran, Dan Zhao. Thermal Driven Test Access Routing in Hyper-interconnected Three-Dimensional System-on-Chip. In Dimitris Gizopoulos, Susumu Horiguchi, Spyros Tragoudas, Mohammad Tehranipoor, editors, 24th IEEE International Symposium on Defect and Fault Tolerance in VLSI Systems, DFT 2009, 7-9 October 2009, Chicago, Illinois, USA. pages 410-418, IEEE Computer Society, 2009. [doi]

@inproceedings{ChandranZ09,
  title = {Thermal Driven Test Access Routing in Hyper-interconnected Three-Dimensional System-on-Chip},
  author = {Unni Chandran and Dan Zhao},
  year = {2009},
  doi = {10.1109/DFT.2009.42},
  url = {http://doi.ieeecomputersociety.org/10.1109/DFT.2009.42},
  tags = {testing, routing},
  researchr = {https://researchr.org/publication/ChandranZ09},
  cites = {0},
  citedby = {0},
  pages = {410-418},
  booktitle = {24th IEEE International Symposium on Defect and Fault Tolerance in VLSI Systems, DFT 2009, 7-9 October 2009, Chicago, Illinois, USA},
  editor = {Dimitris Gizopoulos and Susumu Horiguchi and Spyros Tragoudas and Mohammad Tehranipoor},
  publisher = {IEEE Computer Society},
}