Thermal Driven Test Access Routing in Hyper-interconnected Three-Dimensional System-on-Chip

Unni Chandran, Dan Zhao. Thermal Driven Test Access Routing in Hyper-interconnected Three-Dimensional System-on-Chip. In Dimitris Gizopoulos, Susumu Horiguchi, Spyros Tragoudas, Mohammad Tehranipoor, editors, 24th IEEE International Symposium on Defect and Fault Tolerance in VLSI Systems, DFT 2009, 7-9 October 2009, Chicago, Illinois, USA. pages 410-418, IEEE Computer Society, 2009. [doi]

Abstract

Abstract is missing.