Hao-Ju Chang, Yu-Hung Chen, Hao-Wei Huang, Yihua Yeh, Hung-Ming Chen, Chien-Nan Jimmy Liu. On Awareness of Offset-Via and Teardrop in Advanced Packaging Interconnect Synthesis. In Yuichi Nakamura 0002, Yu Wang 0002, editors, Proceedings of the 30th Asia and South Pacific Design Automation Conference, ASPDAC 2025, Tokyo, Japan, January 20-23, 2025. pages 774-780, ACM, 2025. [doi]
@inproceedings{ChangCHYCL25,
title = {On Awareness of Offset-Via and Teardrop in Advanced Packaging Interconnect Synthesis},
author = {Hao-Ju Chang and Yu-Hung Chen and Hao-Wei Huang and Yihua Yeh and Hung-Ming Chen and Chien-Nan Jimmy Liu},
year = {2025},
doi = {10.1145/3658617.3697735},
url = {https://doi.org/10.1145/3658617.3697735},
researchr = {https://researchr.org/publication/ChangCHYCL25},
cites = {0},
citedby = {0},
pages = {774-780},
booktitle = {Proceedings of the 30th Asia and South Pacific Design Automation Conference, ASPDAC 2025, Tokyo, Japan, January 20-23, 2025},
editor = {Yuichi Nakamura 0002 and Yu Wang 0002},
publisher = {ACM},
isbn = {979-8-4007-0635-6},
}